document: Establishing the discipline of physics-based CMP modeling For the past decade , a physically based comprehensive process model for chemical mechanical polishing has eluded the semiconductor industry . However , a long-term collaborative effort has now resulted in a workable version of that approach . The highly fundamental model is based on advanced finite element analysis and is beginning to show promise in CMP process development
doc_bio_tags: O O O O O B O O O O O O O O O O O O O B I I O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O B I I O O O O O O O B O O
extractive_keyphrases: chemical mechanical polishing cmp finite element analysis
abstractive_keyphrases: physically based process model cmp process development